EnSilica PLC on Monday said it has won a ‘multimillion-pound’ design and manufacturing services contract with a ‘well-funded’ and ‘pioneering’ optical computing services firm.
The Oxford, England-based chip maker of mixed-signal application-specific integrated circuits said the deal includes ‘substantial’ design services engagement and additional manufacturing services, activity for which will now increase ‘significantly’ following the completion of an initial study phase.
Revenue from the deal will contribute to EnSilica’s current financial year, as well as the next two years.
EnSilica also on Monday announced it has opened a second design centre in Campinas, Sao Paulo State, in Brazil, as a result of increased demand.
‘We are pleased to secure this sizable contract with a pioneering optical computing systems company. This agreement not only underscores our capabilities in delivering comprehensive design and manufacturing services but also highlights the growing demand for European-based supply chains,’ said Chief Executive Officer Ian Lankshear.
‘Our strengthened relationships with key wafer foundry and semiconductor supply chain partners enable us to provide high-quality wafers, packages, and completed tested devices.
‘We are also delighted to be opening our second design centre in Brazil, which further underscores our strategic ambitions to expand our global footprint in order to meet the increasing demand for our services.’
Shares in EnSilica were up 2.1% at 39.83 pence in London on Monday afternoon. The stock remains down 33% over the past year.
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